Precision Laser Cutting Solutions for Superior Manufacturing Quality

Customization: Available
After-sales Service: Provided
Warranty: 12 Months

Product Description

Basic Information
Model NO.
YH-QCW
Application
Automotive Industry
Cooling System
Air Cooling
Technical Class
Continuous Wave Laser
Applicable Material
Nonmetal
Structure Type
Gantry Type
Laser Classification
Semiconductor Laser
Laser Technology
Laser Fusion Cutting
Processing Area
300 × 300 mm
Max Ceramic Thickness
< 2 mm
Cutting Shapes
Straight Lines / Custom Contours
Cutting Speed
20 mm/S @ 1mm Al2O3
Compatible Materials
Alumina / Aluminum Nitride (Aln)
Air Supply
0.5–0.8 MPa, 18 M³/H
Production Capacity
50000 Units
Origin
China
Ceramic Laser Processing Equipment

The equipment utilizes high-energy laser technology to scrib, drill, and cut various ceramic materials, specifically optimized for alumina and aluminum nitride processing.

Key Benefits:
  • High Precision: Advanced optical path system paired with a high-stability working platform.
  • High Yield: Consistent processing results ensuring high production quality.
  • Industrial Durability: Designed for 7x24 continuous operating conditions.
  • Automated Operation: Features automatic loading and unloading for unattended processing.
Parameters Specifications
Laser TypeFiber Laser
Processing Format300 * 300mm (Customizable)
Ceramic Thickness< 2mm
Cut ShapeStraight line or Special shape
Cutting Speed20mm/s @ 1mm Alumina; Scribing > 75mm/s @ 1mm Alumina
MaterialsAlumina, Aluminum Nitride, and other ceramics
Required Air Supply0.5-0.8 MPa, Air consumption 18m³/h
Sample & Application Display

Precision processing for ceramic materials such as alumina and aluminum nitride:

Laser Cutting Sample 1
Laser Cutting Sample 2
Laser Cutting Sample 3
Laser Cutting Sample 4
Core Semiconductor Equipment

Specializing in the design and manufacture of advanced semiconductor production equipment:

  • Die Bonders: High-precision chip attachment for IC packaging.
  • Wire Bonders: Reliable interconnects for semiconductor devices.
  • Laser Processing: Wafer marking, grooving, and cutting (Si, SiC, glass, ceramics).
  • Wafer Dicing Saws: Precision cutting for MEMS, optoelectronics, and advanced packaging.
  • Laser Annealing: Systems specifically for Si/SiC wafers.
  • Automatic Dispensing: High-accuracy silicone and epoxy application.
Semiconductor Equipment 1
Semiconductor Equipment 2
Frequently Asked Questions
How do I choose the most suitable machine for my needs?
Please provide details regarding your material type, dimensions, and specific processing requirements. Based on our extensive experience, we will recommend the configuration that best fits your production goals.
What is the warranty period for this laser equipment?
We provide a one-year comprehensive warranty along with 24-hour online professional technical support to ensure your operations remain smooth.
Do you offer customization or OEM services?
Yes, we support OEM, ODM, and custom design services to meet specific industrial requirements and production line integrations.
Can this machine handle materials other than Alumina?
While optimized for Alumina and Aluminum Nitride, the system is capable of processing various non-metallic ceramic materials and specialized substrates used in the semiconductor industry.
What kind of maintenance does the air-cooling system require?
The air-cooling system is designed for low maintenance. Regular checks of the air supply quality (0.5-0.8 MPa) and ensuring the environment is free of excessive dust are usually sufficient for optimal performance.
Is training provided for operating the automatic loading system?
Yes, we provide technical documentation and support to help your operators master the automatic loading/unloading features and CAD-driven contour software.

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