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Home > Zirconia Ceramic Laser Processing Systems > Dual-Head Infrared Sub-Picosecond Laser Diamond Cutting Machine - Ultra-Fast & High Yield Gemstone Processing Solution
Dual-Head Infrared Sub-Picosecond Laser Diamond Cutting Machine - Ultra-Fast & High Yield Gemstone Processing Solution
Dual-Head Infrared Sub-Picosecond Laser Diamond Cutting Machine - Ultra-Fast & High Yield Gemstone Processing Solution
Dual-Head Infrared Sub-Picosecond Laser Diamond Cutting Machine - Ultra-Fast & High Yield Gemstone Processing Solution
Dual-Head Infrared Sub-Picosecond Laser Diamond Cutting Machine - Ultra-Fast & High Yield Gemstone Processing Solution
Dual-Head Infrared Sub-Picosecond Laser Diamond Cutting Machine - Ultra-Fast & High Yield Gemstone Processing Solution
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Dual-Head Infrared Sub-Picosecond Laser Diamond Cutting Machine - Ultra-Fast & High Yield Gemstone Processing Solution
Dual-Head Infrared Sub-Picosecond Laser Diamond Cutting Machine - Ultra-Fast & High Yield Gemstone Processing Solution
Dual-Head Infrared Sub-Picosecond Laser Diamond Cutting Machine - Ultra-Fast & High Yield Gemstone Processing Solution
Dual-Head Infrared Sub-Picosecond Laser Diamond Cutting Machine - Ultra-Fast & High Yield Gemstone Processing Solution
Dual-Head Infrared Sub-Picosecond Laser Diamond Cutting Machine - Ultra-Fast & High Yield Gemstone Processing Solution

Dual-Head Infrared Sub-Picosecond Laser Diamond Cutting Machine - Ultra-Fast & High Yield Gemstone Processing Solution

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Product Description

Basic Information
Model NO.YT-2353
ApplicationHome Appliance, Petroleum Machinery Manufacturing, Aerospace Industry, Automotive Industry, Optical Industry, Glass Industry, Zirconia/Ruby.
Cooling SystemWater Cooling
Technical ClassPulse Laser
Applicable MaterialNonmetal
Structure TypeGantry Type
Laser ClassificationSolid Laser
Laser TechnologyUltrafast Laser
OEM & ODMAccepted
CertificateCE, ISO9001
Specification1600*1900*2000mm
OriginChina
Production Capacity100 sets/Month
Product Description

Infrared Sub-picosecond Laser Diamond Cutting Machine

Ultra-Fast & High Yield Gemstone Processing Solution

Designed specifically for jewelry manufacturers and gemstone producers seeking to scale production, our Dual-Head Infrared Sub-picosecond Laser Zirconia Cutting Machine revolutionizes the way you cut zirconia, diamonds, and other precious stones. This equipment delivers unmatched efficiency, precision, and yield to meet the demands of high-volume orders.

Sub-Picosecond Laser Diamond Cutting Machine
Product Highlights
Laser Cutting Highlight 1 Laser Cutting Highlight 2 Laser Cutting Highlight 3
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Exceptional Material Yield: Optimizes the cutting path to minimize kerf loss. The finished stone yield rate is over 30% higher compared to traditional wire cutting.
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Eco-Friendly: Pollution-free process with minimal consumables and low maintenance.
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Versatile Shaping: Handles materials up to 3mm thickness, processing shapes like Oval, Pear, Round, Tapered Baguette, and Marquise.
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Ultra-Fast Speed: High-peak-power infrared sub-picosecond laser with dual-head design doubles production efficiency.
Integrated Configuration
Integrated Configuration

Includes: 4-Head Splitting Equipment

  • Simultaneous Splitting: Enhances post-processing efficiency.
  • Precision Thickness Control: Zirconia can be split into various precise thicknesses.
  • Smart Control: Easy-to-operate industrial software platform.
Technical Specifications
Laser TypeInfrared Sub-picosecond Laser
Processing Area600mm x 600mm (Customizable)
Machine Dimensions1650mm x 1950mm x 2000mm
Processing Accuracy± 0.02mm
Total Power Consumption6.5 KW
Machine Weight3500 KG
Working VoltageAC380V
Environment RequirementsTemperature: 22°C ± 2°C; Humidity: 30%~60%
Application Areas
Application Samples
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Synthetic Gemstone: Cubic Zirconia (CZ), Moissanite.
✦
Custom Jewelry: Rapid prototyping and unique gem shapes.
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Industrial Ceramics: Precise cutting of brittle hard materials.
R&D and Production Capability
Professional Facility

Specializing in independent research and development of laser generators, optical devices, and automation systems. We provide innovative solutions for micromachining across consumer electronics, semiconductors, and new energy industries.

R&D Team 1 R&D Team 2 R&D Team 3
Lab 1 Lab 2 Lab 3
Production Base
Packing & Delivery
Packaging

Packing: 1 PCS per Wooden Case

Shipping: By sea or international express. Shipping by sea is recommended for heavy cargo.

Delivery Time:
Standard: 30-45 days
Customized: 45-60 days

Our Partners
Global Clients
Frequently Asked Questions
Q1: How much material can I save compared to traditional wire cutting? A: You can expect a finished stone yield rate increase of over 30%, which provides significant cost savings for high-value gemstone materials.
Q2: Can this machine cut shapes other than standard rounds? A: Yes, it excels at processing complex shapes including Pear, Marquise, Tapered Baguette, Oval, and other custom designs for materials under 3mm thickness.
Q3: Is the laser software difficult to operate for new users? A: No, the system features an intuitive industrial software platform designed to streamline your workflow and minimize the learning curve for operators.
Q4: What are the advantages of the dual-head design? A: The dual-head configuration allows for simultaneous processing, effectively doubling your production efficiency and making it ideal for high-volume orders.
Q5: What maintenance is required for the sub-picosecond laser? A: Our laser technology is designed for stable operation with minimal consumables. The process is pollution-free, significantly reducing the frequency of complex maintenance.
Q6: What is the typical lead time for standard versus customized machines? A: Standard machines are typically delivered within 30-45 days, while customized solutions requiring specific configurations take approximately 45-60 days.
Sample 1 Sample 2

Ready to upgrade your production line? Inquire now for a quote or a live demonstration.

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