Glass Laser Cutting/Splitting Integrated Machine
Our technology is deeply versed in high precision cutting of glass, ceramics, semiconductor, diamond, and other materials. We are committed to providing high-efficiency, high-precision laser solutions for brittle machining industries. This equipment is extensively utilized in cutting, drilling and marking various materials, including optical glass, ultra clear glass, soda-lime glass, sapphire and cover glass.
| Model NO. | CW-6050IPL | Laser Power | 50W/70W/90W |
| Cooling System | Water Cooling | Working Area | 600*800mm |
| Technical Class | Pulse Laser | Positioning Accuracy | ±3um |
| Applicable Material | Glass | Processing Speed | ≤1000mm/S |
| Laser Technology | Laser Flame Cutting | Processing Accuracy | ≤30um |
| Laser Type | Ultrafast Laser | Focus Spot | ≤20um |
| Structure Type | Gantry Type | Certification | CE |
| Power Supply | AC 380V±10%, 50Hz/60Hz | Dimensions | 2200*1800*1600mm |






Our company is a national high-tech enterprise owning 150 national patents and participating in the formulation of industry standards. We operate 80,000 square meters of production factories with major R&D and sales bases across various regions. Our products are utilized by global industry leaders, providing high-quality equipment and efficient services to customers in more than 100 countries.





