Factory Glass Laser Cutting/Splitting Integrated Machine for Overload Protection

Customization: Available
Warranty: 12 Months
Application: Aerospace Industry, Automotive Industry, Glass/Semiconductor/3c

Product Description

Product Overview

Glass Laser Cutting/Splitting Integrated Machine

Our technology is deeply versed in high precision cutting of glass, ceramics, semiconductor, diamond, and other materials. We are committed to providing high-efficiency, high-precision laser solutions for brittle machining industries. This equipment is extensively utilized in cutting, drilling and marking various materials, including optical glass, ultra clear glass, soda-lime glass, sapphire and cover glass.

Equipment Advantages:
• Picosecond processing technology for high-speed cutting.
• Optical system with imported lenses for high-quality laser transmission.
• High dimensional accuracy, minimal chipping, and no taper.
Application Fields:
Automotive glass, display covers, optical glass, security glass, home appliance glass panels, lighting glass, and medical glass.
Glass Laser Cutting Machine
Technical Specifications
Model NO.CW-6050IPL Laser Power50W/70W/90W
Cooling SystemWater Cooling Working Area600*800mm
Technical ClassPulse Laser Positioning Accuracy±3um
Applicable MaterialGlass Processing Speed≤1000mm/S
Laser TechnologyLaser Flame Cutting Processing Accuracy≤30um
Laser TypeUltrafast Laser Focus Spot≤20um
Structure TypeGantry Type CertificationCE
Power SupplyAC 380V±10%, 50Hz/60Hz Dimensions2200*1800*1600mm
Key Configurations
  • Ultrafast Technology: Picosecond/Femtosecond laser for "cold" processing with no Heat Affected Zone (HAZ).
  • Chipping-Free: Smooth cutting without fissure; chipping less than 10 micrometers.
  • Intelligent Pathing: Professional optimization to increase production efficiency significantly.
Product Details Gallery
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Manufacturing Excellence
Production Base

Our company is a national high-tech enterprise owning 150 national patents and participating in the formulation of industry standards. We operate 80,000 square meters of production factories with major R&D and sales bases across various regions. Our products are utilized by global industry leaders, providing high-quality equipment and efficient services to customers in more than 100 countries.

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Packaging & After-Sales
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Service Commitment:
1. Comprehensive technical support including remote video guidance and telephone consultation.
2. Long-term stable supply of genuine parts and high-quality consumables.
3. One-year warranty and lifetime service support.
Frequently Asked Questions
Q1: What materials can this machine process?
The machine is optimized for brittle materials including optical glass, ultra-clear glass, soda-lime glass, sapphire, ceramics, and semiconductor substrates.
Q2: What is the benefit of Ultrafast Picosecond Laser technology?
It achieves "cold" processing, which means there is virtually no Heat Affected Zone (HAZ), resulting in smooth edges, no fissures, and minimal chipping (less than 10 microns).
Q3: How accurate is the positioning of the CW-6050IPL?
The system features high precision positioning accuracy of ±3um, suitable for the most demanding electronic and semiconductor applications.
Q4: What is the typical lead time for this equipment?
The standard delivery date is approximately 35 days after receipt of payment, depending on customization requirements.
Q5: What kind of after-sales support do you provide?
We offer a one-year warranty on core components, on-site installation, commissioning, operator training, and 24/7 technical support.
Q6: Is it possible to customize the working area for large formats?
Yes, we provide personalized services for ultra-large working areas to replace traditional techniques with precision laser cutting for non-standard sizes.

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