Our solution is deeply versed in high precision cutting of glass, ceramics, semiconductor, diamond, and other materials. We are committed to providing high-efficiency, high-precision laser solutions for brittle machining industries. This high-performance equipment is extensively utilized in cutting, drilling, and marking various brittle materials, including optical glass, ultra-clear glass, soda-lime glass, sapphire, and cover glass.

• Ultrafast Laser Technology: Picosecond/Femtosecond laser for "cold" processing with minimal Heat Affected Zone (HAZ).
• Chipping-Free Cutting: Unique beam shaping technique for smooth edges without fissures (chipping < 10μm).
• Intelligent Path Optimization: Professional software to significantly increase production efficiency.
• Customized Large Working Area: Personalized service for ultra-large glass cutting requirements.

With a focused spot size as small as a few microns, the machine achieves high positioning accuracy and repeatability, meeting the strictest tolerances of electronics and aerospace industries.

Founded in 2012, our enterprise is a national high-tech entity owning over 150 national patents. We operate 80,000 square meters of production factories across multiple R&D and sales bases. Our products are distributed in more than 100 countries, providing high-quality equipment and efficient services to industrial customers worldwide.

1. We provide comprehensive technical support, including remote video guidance and professional consultation.
2. We promise a long-term and stable supply of genuine parts and high-quality consumables.