Model NO.:WDM-01
Application:IC, Semiconductor
Cooling System:Air Cooling
Technical Class:Continuous Wave Laser
Applicable Material:Metal, Silicon, Glass
Structure Type:Gantry Type
Laser Classification:Semiconductor Laser
Flatness:≤0.002mm
Reach Accuracy:+0.003mm
Spindle Power:1.8kw - 2.4kw
Spindle Speed:6000-60000rpm
Origin:China
Wafer dicing machine for semiconductor equipment
The wafer dicing machine is primarily used for precision cutting of semiconductor wafers, integrated circuits, QFN packages, light-emitting diodes (LEDs), LED chips, solar cells, and electronic substrates. It is compatible with various materials including silicon, quartz, alumina (Al2O3), ferric oxide (Fe2O3), gallium arsenide (GaAs), lithium niobate (LiNbO3), sapphire, and glass.
Working Principle: The machine operates by utilizing an aerostatic spindle to drive a diamond grinding wheel cutting tool at high rotational speeds. This enables precise cutting or grooving of wafers and devices along the predetermined dicing streets.
- Indicator: Displays spindle speed, cutting depth, and operational status in real-time.
- Control System: Central unit manages motion control, speed regulation, and safety protocols.
- Lighting: Integrated illumination for enhanced visibility and alignment inspection.
- Working Table: Precision platform with vacuum suction to secure materials.
| Axis / Component |
Feature |
Specifications (Standard) |
| X axis |
Effective Feed Range / Speed |
310mm / 0.1-1000mm/s |
| Y axis |
Single Step Increment |
0.0001mm |
| Reach Accuracy |
0.003mm / 310mm |
| Z axis |
Repetition Accuracy |
0.001mm |
| Maximum Cutter Diameter |
58mm |
| Spindle |
Speed Range / Power |
6000-60000rpm / 1.8KW-2.4KW |
| Power Source |
Input Voltage |
AC380V±10% |
A
Applications & Material Compatibility
Target Industries:
- IC (Integrated Circuits) & QFN/DFN Packaging
- LED Substrates & Sapphire Thinning
- Optical Communication Components
- Photovoltaic (Solar) Industry
Compatible Materials:
- Silicon Wafers (6-inch, 8-inch, 12-inch)
- Ceramics & Alumina (Al2O3)
- Glass & Quartz
- Lithium Niobate (LiNbO3)
Packaging: Heavy-duty plywood/wooden cases with IPPC certification (ISPM-15 standard). Includes shock-absorbent cushioning (foam, airbags) and weatherproof sealing for international shipping.
Freight Options: Available via Air Freight (recommended for urgency), Sea Freight, and Railway Freight.
Frequently Asked Questions
Q1: What is the cutting accuracy of modern wafer dicing machines?
Advanced machines typically achieve cutting accuracies of ±1-5μm, with high-end models reaching sub-micron precision depending on spindle technology and vibration control.
Q2: What is the difference between blade dicing and laser dicing?
Blade dicing uses diamond-coated blades for mechanical cutting (cost-effective for silicon), while laser dicing employs focused beams for brittle or extremely thin materials, offering a cleaner process with no physical contact.
Q3: How do I choose the right dicing blade?
Selection depends on material hardness (resin-bonded for silicon, metal-bonded for ceramics), wafer thickness, and the required balance between cutting speed and edge quality.
Q4: What maintenance is required for the machine?
Daily inspection of blades and debris removal is essential. Weekly lubrication, monthly linear guide calibration, and annual full system recalibration are recommended for long-term precision.
Q5: Can this machine process materials other than silicon?
Yes, it is highly versatile and can process quartz, sapphire, alumina, gallium arsenide, ceramics, glass, and even PCBs.
Q6: What is the spindle speed range for the WDM-01 model?
The machine features a high-speed aerostatic spindle with a range of 6,000 to 60,000 rpm, ensuring clean and efficient cuts across various densities.
Stylo Laser
