Providing high-efficiency, high-precision laser solutions for brittle machining industries. This high-performance laser equipment is extensively utilized in cutting, drilling, and marking various brittle materials, including optical glass, ultra-clear glass, soda-lime glass, sapphire, and cover glass.
· Ultrafast Laser Technology: Picosecond/Femtosecond laser achieves "cold" processing, leaving virtually no Heat Affected Zone (HAZ).
· Chipping-Free Cutting: Unique beam shaping technique ensures smooth cutting without fissures; chipping stays under 10 micrometers.
· Intelligent Path Optimization: Professional software increases production efficiency significantly.



| Parameter | Detail | Parameter | Detail |
|---|---|---|---|
| Laser Power | 50W/70W/90W | Dimensions | 2200*1800*1600mm |
| Working Area | 600*800mm | Certification | CE |
| Positioning Accuracy | ±3um | Machinery Test Report | Provided |
| Processing Speed | ≤1000mm/s | Warranty | 12 Months |
| Processing Accuracy | ≤30um | Applicable Industries | Glass/Solar/3C |






All equipment is packed in professional export-standard wooden cases to ensure safety during international transit via sea, air, or land.