Advanced Three-Axis Laser Processing System for Precision Manufacturing

Customization: Available
After-sales Service: One Year Warranty
Warranty: One Year Warranty

Product Description

Basic Information

Model NO.AT-61167
OriginChina
Package Size150.0cm * 90.0cm * 150.0cm
Gross Weight2000.0kg

Product Description

The three-axis laser processing system is a high-performance device specifically designed for industrial precision manufacturing. It integrates high-power fiber laser technology, precision motion control, and intelligent software systems to achieve high-precision etching, drilling, slotting, and cutting of materials such as metals and ceramics. It is widely applied in fields such as consumer electronics and microelectronic device manufacturing.

Key Product Features

Dual-mode Processing

  • High-speed Galvanometer Scanning for small area precision.
  • Precision XY Gantry Platform for large-area coverage.
  • Z-axis Electric Adjustment for varying material thicknesses.

High-Precision Performance

  • Minimum 20μm Spot Size for fine feature processing.
  • Micron-level Positioning for consistency and repeatability.
  • Optional Off-axis Visual Positioning for precision stitching.

Material Adaptability

  • Metals: Stainless steel, aluminum alloy, titanium alloy.
  • Ceramics: Alumina, zirconia.
  • Semiconductors and specialized composite materials.

Industry Applications

Consumer Electronics

Mobile phone/tablet structural components, camera modules, sensor fabrication, and PCB marking.

Instrumentation

Precision instrument internal components, sensor elements, and medical device parts.

Microelectronics & Molds

Semiconductor packaging, MEMS devices, mold textures, and injection mold optimization.

Technical Parameters

Category Parameter Specification (FM-SD50)
LaserWavelength / Power1064nm / 50W
LaserModulation Frequency40~1000kHz
GalvanometerScanning Range<50*50mm
GalvanometerRepeatability<1μm
XY WorktableStroke / Repeatability300*300mm / ≤±5μm
Z-axisStroke / Accuracy200mm / ≤±10μm
CCD MonitoringCamera Resolution5 Megapixels (10X Optical)
CapabilitiesMin Hole / Max Thickness20μm / ≤1mm
EnvironmentCooling / PurificationAir Cooling / Triple Dust Purification
PowerSupply / Consumption220V 12A / ≤1200W

Product Gallery

Frequently Asked Questions

Q: What types of materials can this laser system process?

A: It is highly versatile and can process stainless steel, aluminum alloys, titanium alloys, ceramics (like alumina and zirconia), silicon wafers, and various composite materials.

Q: What is the minimum drilling capability?

A: The system can process both blind and through-holes with a minimum diameter of 20μm, making it ideal for microelectronic applications.

Q: Is the worktable size customizable?

A: Yes, while the standard stroke is 300*300mm, the XY worktable stroke can be customized to meet specific industrial requirements.

Q: How does the system ensure long-term industrial reliability?

A: The machine features a modular design for easy maintenance, a comprehensive cooling system, and industrial-grade components selected for 24/7 continuous operation.

Q: Does the system include visual monitoring?

A: Yes, an optional CCD monitoring system with 5-megapixel resolution and 10X optical magnification is available for high-precision positioning and stitching.

Q: What are the main processing functions of this equipment?

A: It supports multiple functions including precision etching, micro-drilling, slotting of micro-structures, and precision cutting with high-quality edge finishes.

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