The three-axis laser processing system is a high-performance device specifically designed for industrial precision manufacturing. It integrates high-power fiber laser technology, precision motion control, and intelligent software systems to achieve high-precision etching, drilling, slotting, and cutting of materials such as metals and ceramics. It is widely applied in fields such as consumer electronics and microelectronic device manufacturing.
Structural components for phones, tablets, camera modules, sensor components, and circuit board marking.
Internal structural components for precision instruments, sensor elements, and medical device components.
Semiconductor packaging components, MEMS device fabrication, and microelectromechanical systems forming.
Microstructure texture processing, optimization of vent holes and runners, and surface strengthening.
| Category | Parameter | FM-SD50 |
|---|---|---|
| Laser | Wavelength / Power | 1064nm / 50W |
| Laser | Modulation Frequency | 40~1000kHz |
| Laser | Beam Quality M2 | <1.3 |
| Galvanometer | Scanning Range | <50*50mm |
| Galvanometer | Repeatability | <1μm |
| XY Worktable | Stroke | 300*300mm (customizable) |
| XY Worktable | Positioning Accuracy | ≤±20μm |
| Z-axis | Stroke / Accuracy | 200mm / ≤±10μm |
| Monitoring | CCD Camera | 5 Megapixels (10X Optical) |
| Capability | Min Hole Diameter | 20μm |
| Capability | Processing Thickness | ≤1mm |
| Cooling | Cooling Method | Air Cooling |
| Power | Power Supply | 220V 50~60Hz 12A |
| Dimensions | Machine Size | 1000 * 1000 * 1700mm |
General operations include technical services, technology development, and consulting in the fields of computer software/hardware, functional glass, and new optical materials. Specialization extends to the sales of optical instruments, specialized semiconductor equipment, CNC machine tools, electronic components, fiber optics, and photovoltaic components.




