The production process equipment and application of silicon carbide materials are the core industries focusing on third-generation semiconductor technology. Relying on independently developed core processes and equipment such as long crystal furnaces, laser glass equipment, and epitaxial furnaces, we integrate resources to provide customers with integrated solutions for silicon carbide materials, processes, and equipment systems, helping the rapid development of the third-generation semiconductor industry.

SiC Material Preparation & Production Line

SiC power devices are used in electric vehicles, charging piles, photovoltaic inverters, high-speed rail, rail transit, smart grid, industrial power supply and other fields, and can gradually replace silicon-based MOSFET and IGBT.

SiC Chip Production Line

SiC Chip and Module

Established in 2019, we are mainly engaged in international trade and integration of semiconductor industry equipment. The equipment is currently exported to over 30 countries, with over 200 customers and suppliers, aiming to control the procurement of the highest cost-effective products for customers and ensure risk avoidance for suppliers.

Main Product Range

• Die Bonder & Wire Bonding
• Laser Marking (ID IC Wafer) & Laser Grooving
• Laser Cutting (Glass Ceramics Wafers Packaging)
• Laser Internal Modification Machine (Si/Sic/Lt/Ln Wafer)
• Laser Annealing Machine for Si/Sic
• Automatic Dicing Saw Machine & Silicone Dispensing Equipment