Stylo Laser
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The production process equipment and application of silicon carbide materials are the core industries focusing on third-generation semiconductor technology. Relying on independently developed core processes and equipment such as long crystal furnaces, laser glass equipment, and epitaxial furnaces, we integrate resources to provide customers with integrated solutions for silicon carbide materials, processes, and equipment systems, helping the rapid development of the third-generation semiconductor industry.
SiC power devices are used in electric vehicles, charging piles, photovoltaic inverters, high-speed rail, rail transit, smart grid, industrial power supply and other fields, and can gradually replace silicon based MOSFET and IGBT.
| Field | SiC Device Advantages | Comparison with Si Devices | Typical Applications |
|---|---|---|---|
| Electric Vehicles (EVs) | - Higher efficiency: 5-10% longer range due to lower switching losses. | Reduced energy loss | Main Inverter, OBC |
Product: SiC Schottky diode chip, silicon carbide MOSFET chip and module.
Application area: Power grid, electric traction, power supply, electric vehicles, household appliances, medical equipment and consumer electronics. SiC products are mainly used in photovoltaic, electric vehicle charging piles, power electronic transformers and other fields.
Engaged in international trade and integration of semiconductor industry equipment. The equipment is currently exported to over 30 countries, with over 200 customers and suppliers, aiming to control the procurement of high cost-effective products and ensure risk avoidance.
Main products: Die Bonder, Wire Bonding, Laser Marking (ID IC Wafer), Laser Grooving, Laser Cutting (Glass Ceramics Wafers Packaging, Laser Internal Modification Machine Si /Sic Wafe, Laser Internal Modification Machine Lt/Ln Wafer, Laser Annealing Machine for Si/Sic, Automatic Dicing Saw Machine (Wafer Packaging)), Automatic Silicone Dispensing Equipment.
