Advanced Microhole Machining System for Precision Engineering Needs

Customization: Available
After-sales Service: One Year Warranty
Warranty: One Year Warranty

Product Description

📊 Overview & Basic Info
Model NO. AT-61168
Trademark ANTTRANS
Origin China
Package Size 150.00cm * 90.00cm * 150.00cm
Gross Weight 2000.000kg
🔍 Product Description
The small-format high-speed microhole machining system is a precision micro-machining equipment based on a high-power, high-stability ultraviolet laser. It is particularly suitable for small-format high-speed microhole machining and can also meet large-format machining requirements through a micron-level high-speed linear motor platform. The system integrates advanced laser technology, precision motion control, and online monitoring technology to provide micron-level precision microhole machining solutions for a variety of materials.
Product Features
Utilizes a high-power, high-stability ultraviolet laser to directly ablate and vaporize materials, resulting in a μm-level heat-affected zone and a minimum processing spot size of 5 μm.
Achieves high-speed, high-precision etching on small formats through precise galvanometer control of beam deflection.
The Z-axis is electrically adjustable to accommodate materials of different thicknesses and meet the requirements for etching three-dimensional structures.
A side-axis high-resolution industrial camera is used for high-precision focusing to ensure machining accuracy and repeatability.
The system employs a marble table top to enhance overall stability, and all mechanical components are carefully selected to ensure long-term precision.
Capable of processing metals, ceramics, organics, glass, and other materials, enabling etching, blind holes, through holes, slotting, and cutting.
Minimum processing line width of 5 μm and a processing range of 50*50 mm.
🚀 Product Applications
Electronics Manufacturing Semiconductor flexible circuit board cutting, ITO film layer etching, microelectronic device manufacturing, printing template preparation, biochip preparation.
Medical Industry Drug filtration, biosensors, microfluidic chips, CC IT positive sample preparation (pore sizes 1-30 μm, suitable for all packaging materials such as vials and ampoules).
Precision Machinery Precision micro-mold forming, micro-nozzle processing, microhole filtration components.
New Energy Lithium battery separator microhole processing (pore size ≤ 3 μm), hydrogen fuel cell bipolar plate microchannel processing.
Scientific Research Microstructure research, material science experiments, micro-nano manufacturing technology development.
Other Applications Carbon fiber micro-cutting, PI micro-masking, silicone microneedle molds, film layer circuit precision etching, inter digitated electrode preparation.
⚙️ Product Parameters
Category Parameter FM-UV3
LaserWavelength355 nm
LaserPower> 3W @ 40 kHz (3-40W optional)
LaserModulation Frequency1-200 kHz
LaserBeam Quality M²< 1.3
GalvanometerScan Range< 50*50 mm
GalvanometerRepeatability< 1 μm
GalvanometerScan Speed≤ 3.5 m/s
Z-AxisTravel200 mm
Z-AxisRepeatability≤ ±3 μm
CCD PositioningCamera Pixels5 million
CapabilityMinimum Pore Size5 μm
CapabilityProcessing Thickness≤ 0.5 mm
CapabilityMicrohole Accuracy± 3 μm
PowerPower Supply220V 50-60Hz 12A
DimensionsDimensions750 * 1100 * 1700 mm
📸 Detailed Photos
Machining System Photo 1
Machining System Photo 2
Machining System Photo 3
Machining System Photo 4
Machining System Photo 5
Frequently Asked Questions
What is the minimum pore size the system can achieve?
The system can achieve a minimum processing pore size of 5 μm with an accuracy of ± 3 μm.
What materials are compatible with this laser machining system?
It is capable of processing a wide range of materials including metals, alloys, ceramics, organics, glass, and silicon wafers.
What are the primary applications in the medical industry?
Common medical applications include drug filtration, biosensors, microfluidic chips, and CC IT positive sample preparation for various packaging materials.
How does the system ensure machining precision?
The system utilizes a high-resolution industrial camera for high-precision focusing, a marble table top for stability, and precise galvanometer control of beam deflection.
What is the maximum processing thickness?
The equipment is designed for precision work with a processing thickness typically ≤ 0.5 mm, maintaining a high depth-to-width ratio of over 10:1.
Does the system require special cooling?
Yes, the system is designed with a water-cooled cooling method to ensure high-power laser stability during operation.

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