The small-format high-speed microhole machining system is a precision micro-machining equipment based on a high-power, high-stability ultraviolet laser. It is particularly suitable for small-format high-speed microhole machining and can also meet large-format machining requirements through a micron-level high-speed linear motor platform. The system integrates advanced laser technology, precision motion control, and online monitoring technology to provide micron-level precision microhole machining solutions for a variety of materials.
Semiconductor flexible circuit board cutting, ITO film layer etching, microelectronic device manufacturing.
Drug filtration, biosensors, microfluidic chips, CC IT positive sample preparation (1-30 μm).
Precision micro-mold forming, micro-nozzle processing, microhole filtration components.
Lithium battery separator microhole processing (≤ 3 μm), hydrogen fuel cell bipolar plate processing.
Microstructure research, material science experiments, micro-nano manufacturing technology development.
| Category | Parameter | FM-UV3 Specification |
|---|---|---|
| Laser | Wavelength | 355 nm |
| Laser | Power | > 3W @ 40 kHz (3-40W optional) |
| Laser | Beam Quality M² | < 1.3 |
| Galvanometer | Scan Range | < 50*50 mm |
| Galvanometer | Repeatability | < 1 μm |
| Z-Axis | Travel | 200 mm |
| Processing | Minimum Pore Size | 5 μm |
| Processing | Processing Thickness | ≤ 0.5 mm |
| Processing | Depth-to-Width Ratio | > 10:1 |
| Dimensions | System Size | 750 * 1100 * 1700 mm |
Operations encompass technical services, technology development, and consulting. Expertise includes wholesale and retail of computer software/hardware, graphic design, and the sales of functional glass and new optical materials. Specialized in optical instruments, semiconductor device equipment, CNC machine tools, and electronic components. Providing solutions for metal cutting, welding equipment, photovoltaic components, and electronic specialized materials.