Precision Microhole Machining System for Efficient Production Processes

Customization: Available
After-sales Service: One Year Warranty
Warranty: One Year Warranty

Product Description

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Overview

Model NO. AT-61168
Origin China
Package Size 150.00cm * 90.00cm * 150.00cm
Gross Weight 2000.000kg
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Product Description

The small-format high-speed microhole machining system is a precision micro-machining equipment based on a high-power, high-stability ultraviolet laser. It is particularly suitable for small-format high-speed microhole machining and can also meet large-format machining requirements through a micron-level high-speed linear motor platform. The system integrates advanced laser technology, precision motion control, and online monitoring technology to provide micron-level precision microhole machining solutions for a variety of materials.

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Product Features

  • Utilizes a high-power, high-stability ultraviolet laser for direct ablation with a minimum processing spot size of 5 μm.
  • Achieves high-speed, high-precision etching through precise galvanometer control.
  • Electrically adjustable Z-axis to accommodate different material thicknesses and 3D etching.
  • High-resolution industrial camera for high-precision focusing and repeatability.
  • Marble table top construction to enhance overall stability and long-term precision.
  • Versatile processing for metals, ceramics, organics, glass, and more.
  • Minimum processing line width of 5 μm with a 50*50 mm range.
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Product Applications

Electronics Manufacturing

Semiconductor flexible circuit board cutting, ITO film layer etching, microelectronic device manufacturing.

Medical Industry

Drug filtration, biosensors, microfluidic chips, CC IT positive sample preparation (1-30 μm).

Precision Machinery

Precision micro-mold forming, micro-nozzle processing, microhole filtration components.

New Energy

Lithium battery separator microhole processing (≤ 3 μm), hydrogen fuel cell bipolar plate processing.

Scientific Research

Microstructure research, material science experiments, micro-nano manufacturing technology development.

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Product Parameters

Category Parameter FM-UV3 Specification
LaserWavelength355 nm
LaserPower> 3W @ 40 kHz (3-40W optional)
LaserBeam Quality M²< 1.3
GalvanometerScan Range< 50*50 mm
GalvanometerRepeatability< 1 μm
Z-AxisTravel200 mm
ProcessingMinimum Pore Size5 μm
ProcessingProcessing Thickness≤ 0.5 mm
ProcessingDepth-to-Width Ratio> 10:1
DimensionsSystem Size750 * 1100 * 1700 mm
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Technical Scope

Operations encompass technical services, technology development, and consulting. Expertise includes wholesale and retail of computer software/hardware, graphic design, and the sales of functional glass and new optical materials. Specialized in optical instruments, semiconductor device equipment, CNC machine tools, and electronic components. Providing solutions for metal cutting, welding equipment, photovoltaic components, and electronic specialized materials.

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Detailed Photos

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Frequently Asked Questions

What is the minimum pore size the system can achieve?
The system can achieve a minimum processing pore size of 5 μm with an accuracy of ± 3 μm.
Which materials are compatible with this laser system?
It is capable of processing a wide range of materials including silicon wafers, various metals and alloys, ceramics, organics, glass, and carbon fiber.
What is the processing range of the galvanometer?
The system features a scan range of less than 50*50 mm with a repeatability of less than 1 μm.
How does the system ensure machining stability?
The system utilizes a heavy-duty marble table top and high-quality mechanical components to minimize vibration and maintain long-term precision.
What cooling and dust extraction methods are used?
The system is water-cooled for thermal management and employs a triple dust purification method for extraction.
Can the system handle three-dimensional etching?
Yes, the Z-axis is electrically adjustable to meet the requirements for etching three-dimensional structures and different material thicknesses.

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