Small-Format High-Speed Microhole Machining System

Customization: Available
After-sales Service: One Year Warranty
Warranty: One Year Warranty

Product Description

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Basic Specifications

Model Number AT-61168
Origin China
Package Size 150.00cm * 90.00cm * 150.00cm
Gross Weight 2000.000kg
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Product Description

The small-format high-speed microhole machining system is a precision micro-machining equipment based on a high-power, high-stability ultraviolet laser. It is particularly suitable for small-format high-speed microhole machining and can also meet large-format machining requirements through a micron-level high-speed linear motor platform. The system integrates advanced laser technology, precision motion control, and online monitoring technology to provide micron-level precision microhole machining solutions for a variety of materials.
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Key Features

  • High-power ultraviolet laser for direct ablation with minimal heat-affected zone (μm-level).
  • Minimum processing spot size of 5 μm and processing range of 50*50 mm.
  • Precise galvanometer control for high-speed beam deflection and etching.
  • Electrically adjustable Z-axis for varying material thicknesses and 3D structures.
  • Side-axis high-resolution industrial camera for micron-level focusing accuracy.
  • Stable marble table top ensures long-term mechanical precision.
  • Versatile processing: metals, ceramics, glass, and organic materials.
  • Supports blind holes, through holes, slotting, and precision cutting.
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Industry Applications

Electronics Semiconductor circuit cutting, ITO etching, biochip preparation.
Medical Drug filtration, biosensors, microfluidic chips, CCIT packaging.
Precision Machinery Micro-mold forming, micro-nozzle processing, filtration components.
New Energy Lithium separator processing (≤ 3 μm), hydrogen cell microchannels.
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Technical Parameters

Category Parameter FM-UV3 Details
LaserWavelength355 nm
LaserPower> 3W @ 40 kHz (3-40W optional)
LaserModulation Frequency1-200 kHz
LaserPower Stability (8h)< 3%
GalvanometerScan Range< 50*50 mm
GalvanometerRepeatability< 1 μm
GalvanometerScan Speed≤ 3.5 m/s
Z-AxisTravel200 mm
Z-AxisPositioning Accuracy≤ ±5 μm
MonitoringCamera Pixels5 million
CapabilityMinimum Pore Size5 μm
CapabilityProcessing Thickness≤ 0.5 mm
CoolingCooling MethodWater-cooled
PowerConsumption≤ 1500W
DimensionsMachine Size750 * 1100 * 1700 mm
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Professional Services

We provide comprehensive technical services, technology development, and consulting. Our expertise spans computer hardware/software auxiliary equipment, functional glass, and new optical materials. We specialize in the sale and support of optical instruments, specialized semiconductor equipment, experimental analysis tools, CNC machine tools, and electronic components. Our commitment includes metal cutting and welding solutions, photovoltaic components, and advanced electronic materials.
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Product Gallery

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Frequently Asked Questions

What is the minimum hole size the system can process?
The system can achieve a minimum processing pore size of 5 μm with a processing line width of 5 μm.
What materials are compatible with this UV laser system?
It is capable of processing a wide range of materials including metals, ceramics, organic materials, glass, silicon wafers, and various alloys.
Can the system handle different material thicknesses?
Yes, the Z-axis is electrically adjustable to accommodate different thicknesses and can even process three-dimensional structures.
What ensures the precision of the microhole machining?
Precision is ensured by a high-resolution industrial camera for focusing, a high-stability marble table, and advanced galvanometer control with < 1 μm repeatability.
Is the system suitable for mass production in electronics?
Absolutely. It is designed for high-speed manufacturing in semiconductor circuit cutting, ITO film etching, and flexible board processing.
What are the cooling and power requirements?
The system uses a water-cooled method and operates on a 220V 50-60Hz power supply with a consumption of ≤ 1500W.

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