Advanced Laser Micro-Machining System/High-Precision Laser Micro-Machining

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Advanced Laser Micro-Machining System/High-Precision Laser Micro-Machining

Customization:	Available
After-sales Service:	One Year Warranty
Warranty:	One Year Warranty

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Product Description

Basic Info & Logistics

Model NO. AT-61157

Origin China

Package Size 50.00cm * 60.00cm * 50.00cm

Gross Weight 30.000kg

Key Features

⚡
Utilizes high-power ultraviolet lasers for material ablation with a μm-level heat-affected zone.
🎯
Precise galvanometer control achieving high-speed etching on small surfaces.
📐
Linear motor-driven platform for large-surface precision machining.
↕️
Electrically adjustable Z-axis to accommodate varying material thicknesses and 3D structures.
🔄
Expandable A and C axes suitable for machining irregularly shaped parts.
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High-resolution industrial cameras for full-field error correction and precision focusing.
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Marble tabletop construction to enhance overall system stability and long-term accuracy.
🛠️
Capable of processing metals, ceramics, glass, and organics for drilling, slotting, and cutting.

Product Applications

Semiconductor flexible circuit board cutting ITO film layer etching Microelectronic device manufacturing Printing template preparation Biochip preparation Precision micro-mold forming

Core Capabilities

Technical services and technology development focused on optical instruments and specialized equipment for semiconductor devices. Expertise includes experimental analysis instruments, CNC machine tools, electronic components, and electromechanical equipment. Specialized in sales of functional glass, new optical materials, photovoltaic equipment, and electronic specialized materials.

Product Parameters

Category	Parameter	FM-UVM20A	FM-UVM20B
Laser	Wavelength	355nm	355nm
Laser	Power	20W (3~40W optional)	20W (3~40W optional)
Laser	Pulse Width	15ns@40kHz	15ns@40kHz
Galvanometer	Scan Range	<50*50mm	<15*15mm
Galvanometer	Repeatability	<1μm	<1μm
XY Stage	Travel	300*300mm	300*300mm
XY Stage	Positioning Accuracy	≤±3μm	≤±3μm
Z Axis	Travel	150mm	150mm
CCD Positioning	Camera	5-megapixel	5-megapixel
Capabilities	Minimum Spot Size	8μm	5μm
Capabilities	Processing Materials	Glass, organics, metals, ceramics	Glass, organics, metals, ceramics
Weight	Total Weight	1200Kg	1200Kg

Note: Achieved after preheating for 30 minutes at a constant temperature of (25±0.5ºC).

Detailed Photos

Frequently Asked Questions

What materials can this laser system process?

The system is highly versatile and can process a wide range of materials including metals, ceramics, organics, glass, and semiconductor materials.

What is the minimum processing spot size?

Depending on the model (FM-UVM20A/B), the system can achieve a minimum processing spot size of 5μm to 8μm for ultra-high precision work.

Does the machine support 3D etching and micro-drilling?

Yes, the Z-axis is electrically adjustable to meet the requirements for etching three-dimensional structures, blind hole drilling, and through-hole drilling.

How is the long-term stability of the system ensured?

The system utilizes a marble tabletop for superior mechanical stability, paired with high-precision linear motors and industrial camera feedback for continuous error correction.

What cooling and environmental systems are required?

The system is water-cooled and features a built-in triple dust purification extraction method to maintain a clean processing environment.