• ⚡ High-energy density and stable ultraviolet laser directly ablates and vaporizes materials, with a μm-level heat-affected zone and a minimum processing spot size of 5μm.
• 🔍 High-resolution camera and high-precision linear motor-driven platform enable sub-micron-level alignment of circular hole centers.
• 🎯 Precision Z-axis achieves high-precision focusing to ensure stable and repeatable processing techniques.
• 🔄 Sub-micron-level runout spindle enables high-speed, high-precision, and high-surface-finish micro-machining.
• ⚙️ Auxiliary W-axis allows for the processing of both straight holes and inverted taper holes.
• 💎 Marble tabletop enhances overall system stability, ensuring long-term mechanical precision.
• 📏 Minimum processing hole diameter of 5μm with a controllable depth-to-width ratio > 10:1.

Our operation specializes in advanced technical services and technology development. Key areas include the sale of functional glass, new optical materials, optical instruments, and specialized semiconductor equipment. We provide high-precision CNC machine tools, experimental analysis instruments, and electronic components. Our expertise extends to metal cutting and welding equipment, fiber optics, photovoltaic components, and specialized electronic materials.