Picosecond Laser Ultra-Precision Machining System for Semiconductors

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Picosecond Laser Ultra-Precision Machining System for Semiconductors

Customization:	Available
Structure:	Vertical Drilling Machine
Layout:	Vertical

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Product Description

⚙️ Basic Info.

Controlling Mode:CNC

Automatic Grade:Automatic

Precision:High Precision

Certification:CE, ISO 9001

Condition:New

Transport Package:Polywood Box

Origin:China

Capacity:1000/ Year

💎 Picosecond Laser Ultra-precision Machining System

Key Features

High-power UV laser for direct ablation with μm-level processing aperture.
Imported precision galvanometers for high-speed beam deflection control.
Micron-level high-speed linear motor platform for large-format processing.
Electrically adjustable Z-axis for various material thicknesses and taper hole requirements.
Full-frame error correction using super-resolution industrial cameras.
Stable marble countertops and carefully selected mechanical components.
Processing accuracy up to ±4μm with a minimum micropore diameter of 5μm.

🎯 Equipment Application

Ideal for precision micromachining of metals, ceramics, silicon wafers, glass, and organics.

📊 Technical Specification

Items	Parameter	FM-UVM3A	FM-UVM3B
Laser Wave	355nm	355nm
Laser Power	>3W@40kHz	3-40W optional
Pulse Width	15ns@40kHz	15ns
Scan Area	Galvo	<50*50mm	<15*15mm
XY Travel	Tables	300300mm (600600mm optional)
XY Accuracy	Positioning	≤±3um
Z-axis Travel	Manual/Electric	150mm
Min Spot	Processing	8um	5um
Materials	Processing Range	Glass, organics, metals, ceramics, etc.
Dimensions	Measure	120012001900mm
Weight	Total	1200Kg

🚀 Other Product Lines

📦 Packing & Delivery

Standard Warranty:
12 months after shipping

Extended Warranty:
Optional coverage up to 36 months

Global Support:
24/7 technical assistance

Free Training:
On-site or remote operation training

🏭 Manufacturing Profile

The manufacturing facility is a technology-driven enterprise specializing in the R&D, production, and sales of industrial laser application systems. We provide precision solutions for micro-hole, micro-groove, micro-welding, and precision cutting.

Our developed series includes Femtosecond Laser Systems, Picosecond Ultra-Fine Systems, and Roll-to-Roll Film Processing Systems, serving industries like biomedicine, semiconductors, and new energy.

❓ Frequently Asked Questions

Q1: Are you a direct manufacturer for these laser systems?

Yes, we are a factory specializing in the production of laser drilling and machining systems, providing comprehensive solutions to our global clients.

Q2: What is the typical lead time for an order?

Standard models usually take 1-3 months. For hot items, we may have stock available for faster delivery, while special projects require longer customization time.

Q3: Which materials can be processed by the Picosecond laser system?

The system is highly versatile and can process glass, organics, metals, ceramics, silicon wafers, and other sensitive materials with high precision.

Q4: What types of payment terms do you support?

We generally accept T/T and L/C for machinery orders. Other payment methods can be discussed for tools and smaller components.

Q5: How quickly can I receive a technical quotation?

We respond to initial inquiries within 1 hour. A detailed technical quotation for standard machines is usually provided within 3 days after confirming requirements.

Q6: Do you provide on-site installation and training?

Yes, we offer both on-site and remote operation and maintenance training for free to ensure your team can operate the system efficiently.