Advanced Laser Marking System for Electronic Component Customization

Customization:	Available
After-sales Service:	Provided
Warranty:	Provided

🔹 Basic Information

Model NO.:EP-15-THG-S

Laser Visibility:Visible

Applicable Material:Metal

Cooling System:Air Cooling

Technical Class:Continuous Wave Laser

Laser Wavelength:Fiber Laser

Laser Classification:Semiconductor Laser

Type:YAG Laser Marking Machine

Marking Method:Scanning Marking

Product Name:UV Laser Marking

Feature 1:Guaranteed Quality

Feature 2:Customized According to Needs

Origin:China

Capacity:100 Units

💡 Product Description

Brief Description

✔ Marking of electronic products' LOGO, model, and origin.
✔ High-speed marking of food, PVC pipe, and medicine packaging (HDPE, PO, PP).
✔ Superfine micro-hole drilling (diameter d≤10μm).
✔ Specialized PCB marking and high-precision cutting.

Core Features

⭐ Cold Laser Processing: Minimal heat-affected zone for superior processing quality.

⭐ Wide Material Range: Compensates for limitations in infrared laser processing.

⭐ Superfine Marking: Exceptional beam quality with a small focusing spot.

⭐ High Efficiency: Fast marking speeds combined with high precision.

⭐ Low Maintenance: No consumables required, ensuring low operation costs.

⭐ Industrial Stability: Supports long-term, continuous 24/7 operation.

Technical Specifications

Machine Model	EP-15/25/30-THG-S
Laser Wavelength	355nm
Laser Power	4W / 7W / 10W / 15W / 25W
Min. Marking Line Width	10µm - 15µm
Marking Speed	250 characters/sec
Marking Scope	100*100mm
Standard Lens	F160
Pulse Repetition Frequency	10 - 200kHz
Cooling Mode	Water Cooling
Power Supply	AC 220V, 50Hz, 16A
Total Power Consumption	≤1.5kW
Overall Dimension	800mm * 950mm * 1630mm

🌍 Industry Presence & Capability

Specializing in international trade and integration of semiconductor industry equipment. The equipment is currently utilized in over 30 countries with over 200 global customers and suppliers. We aim to provide the most cost-effective procurement solutions and risk avoidance strategies for high-end manufacturing.

Main Product Range: Die Bonder, Wire Bonding, Laser Marking (ID IC Wafer), Laser Grooving, Laser Cutting (Glass Ceramics Wafers), Laser Internal Modification Machines (Si/Sic, Lt/Ln), Laser Annealing, Automatic Dicing Saw Machines, and Silicone Dispensing Equipment.

📦 Packaging & Shipping

❓ Frequently Asked Questions

Q1: How do I choose the most suitable machine? A: Please provide your material type, dimensions, and specific functional requirements. Based on our experience, we will recommend the optimal configuration for your needs.

Q2: What is the standard warranty period for this equipment? A: We provide a one-year comprehensive warranty along with 24-hour online professional technical support to ensure smooth operation.

Q3: Does the UV laser marking machine require consumables? A: No, our UV laser marking systems are designed for high efficiency with no daily consumables required, significantly lowering your long-term maintenance costs.

Q4: Can this machine be integrated into an automated production line? A: Yes, the system supports various industrial communication protocols and can be easily integrated into automated production environments for high-volume tasks.

Q5: What materials are best suited for UV laser marking? A: UV lasers are ideal for materials sensitive to heat, such as various plastics (HDPE, PP, PO), glass, ceramics, and PCB boards, providing high-contrast marks without burning.

Q6: How is the equipment protected during international shipping? A: We use professional-grade customized wooden box packaging to ensure the machine is protected against vibrations and impacts during sea or air transit.