Advanced Laser Processing Systems for Silicon Carbide Wafers

1 / 5

Advanced Laser Processing Systems for Silicon Carbide Wafers

Customization:	Available
After-sales Service:	Provided
Precision:	High Precision

Send Inquiry

Product Description

Basic Info.

Model NO.

WLE-01

Condition

New

Certification

RoHS, ISO, CE

Warranty

12 Months

Automatic Grade

Automatic

Installation

Desktop

Driven Type

Electric

Product Name

Wafer Laser Processing Machine

After-Sale Service

Provided

Production Capacity

5000

Origin

China

Product Description

Customization Silicon Carbide Wafer Laser Processing Machine

Standard Features

Computer Control, Windows OS
CCD visual positioning system
Servo Motor
UPS and voltage stabilizer
ESD grounding point
CE certified

Optional Features

Automatic constant temperature system
Laser Height Detection
Z-axis automatic calibration
Customized fluid management

Product Advantage: TSV Series desktop system is applicable for LENS dispensing, FPC package, SMT red glue dispensing, solder past dispensing, LED package, fingerprint identification module, etc.

Specifications	TSV-300	HSV-300
Dimension (mm)	L810×W660×H760	L900×W650×H1460
Weight (kg)	105	190
Control	Industrial personal computer + motion control card
Software	Control software + Windows system
Programming	Visual programming
Number of spindles	X, Y, Z
Spindle drive	Servo motor + module
Working area (mm)	X:260 ; Y:260 ; Z:100
Max. Moving speed (mm/s)	800
Repeatability (mm)	± 0.025
Power supply	220V 50/60Hz
Safety standards	CE

Exhibition & Customers

Established in 2019, our factory is mainly engaged in international trade and integration of semiconductor industry equipment. The equipment is currently exported to over 30 countries, with over 200 customers and suppliers globally. We aim to control procurement for the highest cost-effective products and ensure risk avoidance for all partners.

Main Products: Die Bonder, Wire Bonding, Laser Marking (ID IC Wafer), Laser Grooving, Laser Cutting (Glass Ceramics Wafers Packaging), Laser Internal Modification Machines (Si/Sic/Lt/Ln Wafers), Laser Annealing Machines, Automatic Dicing Saw Machines, and Silicone Dispensing Equipment.

Packaging & Shipping

Frequently Asked Questions

How to choose a suitable machine?

You can tell us the working piece material, size, and the specific request for machine function. We can recommend the most suitable configuration according to our industrial experience.

What is the warranty period for the equipment?

We provide a one-year warranty and 24-hour online professional technical support for all our machines.

What are the core advantages of the TSV series?

The system offers high-precision repeatability (± 0.025 mm), high moving speeds up to 800mm/s, and is versatile for LENS dispensing, FPC packaging, and SMT applications.

Does the machine support customized features?

Yes, we provide OEM/ODM and customized design services. Optional features like laser height detection and constant temperature systems can be integrated based on your needs.

What operating system does the software use?

The equipment uses professional control software running on a standard Windows OS environment for ease of use and compatibility.

What safety standards do your machines follow?

All our wafer laser processing machines are CE certified and include standard safety features like UPS, voltage stabilizers, and ESD grounding points.