Stylo Laser
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| Parameter | Specification |
|---|---|
| Maximum Exposure Size (Large) | 24.5" x 28.5" (622.3 mm x 723.9 mm) |
| Maximum Exposure Size (Standard) | 22" x 24.5" (558.8 mm x 622.3 mm) |
| Registration Accuracy | +/-10 um |
| Light Source | 405 nm |
| Line Width Precision | +/-10% |
| Panel Thickness (Single Machine) | 0.05 mm to 5.0 mm |
| Panel Thickness (In-line) | 0.075 mm to 2.5 mm |
| Interlayer Alignment Accuracy | +/-20 um |
| Depth of Field | +/-300 um |
Providing international trade and integration of semiconductor industry equipment. Our equipment is exported to over 30 countries with extensive customer and supplier networks. We aim to provide cost-effective products and risk avoidance for our partners.
Main Product Categories: Die Bonder, Wire Bonding, Laser Marking (ID IC Wafer), Laser Grooving, Laser Cutting (Glass Ceramics Wafers Packaging), Laser Internal Modification Machines, Laser Annealing, and Automatic Silicone Dispensing Equipment.
