High-Speed Laser IC Marking System for Efficient Production

Customization: Available
After-sales Service: Provided
Warranty: 12 Months

Product Description

1

Basic Information

Model NO.
LG-01
Laser Visibility
Visible
Applicable Material
Metal
Cooling System
Air Cooling
Technical Class
Continuous Wave Laser
Laser Wavelength
Fiber Laser
Laser Classification
Semiconductor Laser
Type
YAG Laser Marking Machine
Marking Method
Scanning Marking
Product Name
Laser IC Marking Equipment
Feature 1
High Precision
Feature 2
High Efficiency
After-Sale Service
Provided
Origin
China
2

Product Description

Laser IC Marking Equipment Support Lot End Printing Clearance Function

High-Speed Laser IC Marking System

Equipment Features

  • Support MES Mark module system
  • Mark Auto download
  • Automatic generation of printing information
  • Supports Mark 2D functionality
  • Automatically read Mapping to distinguish printing defects
  • Support LOT END printing clearance function
  • Support scanning to replace text
  • Automatic text alignment with fixed text width
Laser IC Layout
System Detail 1
System Detail 2
No. Feature Description
1MES Mark Module SystemSupports integration with Manufacturing Execution Systems (MES) for traceability.
2Mark Auto DownloadAutomatically downloads marking data from connected systems.
3Automatic Printing Info GenerationDynamically generates printing content without manual input.
42D Mark FunctionalityCapable of printing high-precision 2D codes (QR, DataMatrix) for tracking.
5Automatic Mapping & Defect DetectionUses mapping technology to identify and flag printing defects.
6LOT END Printing ClearanceAutomatically clears or finalizes marks at the end of a production batch.
7Scan-to-Text ReplacementAllows scanning existing marks to update/replace text dynamically.
8Auto Text Alignment & Fixed WidthEnsures consistent text alignment and uniform character spacing.
3

Key Applications

Application 1
Application 2
  • Semiconductor IC marking (e.g., chip serialization)
  • Electronics traceability (2D codes for anti-counterfeiting)
  • Automated production lines (MES integration for real-time data)
4

Exhibition & Customers

Exhibition Photo
Customer Visit

Currently imported and exported to over 30 countries, with over 200 customers and suppliers, aiming to control the procurement of the highest cost-effective products. Our main products include: Die Bonder, Wire Bonding, Laser Marking (ID IC Wafer), Laser Grooving, Laser Cutting (Glass Ceramics Wafers Packaging), Laser Internal Modification Machines, Laser Annealing Machines, and Automatic Dicing Saw Machines.

5

Packaging & Shipping

Professional Packaging
6

Frequently Asked Questions

How to choose a suitable machine?
You can tell us the working piece material, size, and the request of machine function. We can recommend the most suitable machine according to our experience.
What is the warranty period for the equipment?
One year warranty and 24 hours online professional technical support are provided.
Why choose us?
We offer OEM/ODM and customized design services to meet specific industrial requirements.
Does this equipment support MES integration?
Yes, it fully supports the MES Mark module system for seamless integration with Manufacturing Execution Systems.
What types of 2D codes can be marked?
The equipment is capable of printing high-precision 2D codes such as QR codes and DataMatrix for electronic traceability.
Is the marking content generated automatically?
Yes, the system supports automatic generation of printing information, including serial numbers and date codes.

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