High-Precision UV Laser Marking System for PCBA Components

Customization:	Available
After-sales Service:	Provided
Warranty:	Provided

Basic Information

Model NO. PCBA-01

Laser Visibility Visible

Applicable Material Metal

Cooling System Air Cooling

Technical Class Continuous Wave Laser

Laser Wavelength UV Laser, CO2 Laser

Laser Classification Semiconductor Laser

Type YAG Laser Marking Machine

Marking Method Scanning Marking

Product Name PCBA & IC & Wafer Marking Machine

Quality Guaranteed Quality

Origin China

Product Description

Brief Description: Applicable for the packaged IC marking of DIP, QFN and BGA.

Key Features:

✓ Fully-automatic loading and unloading from hanging basket to hanging basket, stable laser output, direction inspection function of intelligent vision system, sampling inspection function of marking effect.
✓ Friendly HMI (Human-Machine Interface) for easy operation.
✓ Imported double-head 20W fiber laser marking system; the green laser, UV laser, CO2 laser and other laser sources are optional.
✓ Equipped with a special fume removal device to quickly extract fume and dust produced during marking to protect the environment.
✓ Complies with CE MARK and SEMI standards.

Technical Specification

Parameter	HDZ-SIC100	HDZ-SIC200
Marking scope	320mm*160mm	320mm*160mm
Product specification	L: 160-320mm; W: 30-80mm	L: 160-320mm; W: 30-80mm
Font	TFT and SHX; with font library module modification program
Repeated positioning precision	±0.1mm	±0.1mm
UPH	1200 pieces/h (idle)	1200 pieces/h (idle)
Power supply	AC 220V, 50/60Hz	AC 220V, 50/60Hz
Air source	0.6-0.8 MPa	0.6-0.8 MPa
Overall dimension	2525mm1665mm2000mm	2515mm1420mm2000mm

Exhibition & Industry Experience

Expertise in international trade and integration of semiconductor industry equipment, serving customers in over 30 countries. Our main product range includes Die Bonder, Wire Bonding, Laser Marking (ID IC Wafer), Laser Grooving, Laser Cutting (Glass Ceramics Wafers Packaging), Laser Internal Modification Machine (Si/SiC/LT/LN Wafer), Laser Annealing Machine, Automatic Dicing Saw, and Automatic Silicone Dispensing Equipment.

Packaging & Shipping

Frequently Asked Questions

How to choose a suitable machine?

You can share your working piece material, size, and the required functions. We will recommend the most suitable machine based on our extensive industry experience.

What is the warranty period for the equipment?

We provide a one-year warranty along with 24-hour online professional technical support to ensure your operations run smoothly.

Which laser sources are available for this machine?

The system supports imported double-head 20W fiber laser marking; however, green laser, UV laser, and CO2 laser sources are also available as options.

What types of IC packaging can this machine mark?

This equipment is specifically designed for high-precision marking on packaged ICs including DIP, QFN, and BGA formats.

Does the machine include environmental protection features?

Yes, it features a specialized fume removal device that quickly extracts smoke and dust generated during the laser marking process.

Is the marking process monitored for quality?

Yes, the system includes an intelligent vision system for direction inspection and a sampling inspection function to verify the marking effect.