Fully Automatic Green Laser Cutting System for Sic Wafer Dicing

Customization: Available
After-sales Service: Provided
Warranty: 12 Months

Product Description

Basic Information

Model NO.
GLC-01
Cooling System
Air Cooling
Laser Source
532nm Green Laser, 30W
Technical Class
Continuous Wave Laser
Applicable Material
Metal, Brittle Materials
Structure Type
Gantry Type
Cutting Precision
±0.05mm
Processing Area
150×150mm
Dimensions
1410 × 1350 × 2070mm
Weight
1090kg
Origin
China

Product Description

Our Precision Green Laser Cutting System represents the forefront of laser processing technology for brittle and heat-sensitive materials. Utilizing a specialized 532nm wavelength laser source, this machine delivers exceptional cutting precision with minimal thermal impact, making it ideal for high-value manufacturing applications in electronics, medical devices, and advanced materials processing.

Green Laser Cutting System 1
Green Laser Cutting System 2

Technical Parameters

Parameter Specification
ModelGreen Laser Cutting Machine
Laser TypeGreen Laser (532nm)
Laser Power30W
Cutting Precision±0.05mm
Cutting Width<0.15mm
Processing Area150×150mm (Customizable)
Control ModeAutomatic
Cooling MethodWater-cooled
Power Supply220V/50Hz

Applications

Application Overview
Industry Application
ElectronicsPCB cutting, semiconductor processing
Medical DevicesPrecision component manufacturing
Advanced MaterialsCeramic drilling, diamond cutting
Precision ManufacturingGlass perforation, brittle material processing

Core Technical Configuration

Component Specification
Machine StructureIntegrated Sheet Metal Cabinet + Marble Platform
Motion SystemLinear Motors (X/Y-axis: 200mm) + Ball Screw Z-axis (100mm)
Cooling SystemDual-Temperature Controlled Water Chiller
Vision SystemCustom CCD Monitoring System
Industrial PCYanhua Industrial Computer
Fume ExtractionCustom Smoke Extraction System
Performance & Features
  • Materials: Brittle materials, high-hardness metals, thermal-sensitive substrates
  • Quality: Smooth edges, burr-free, minimal heat-affected zone
  • Safety: Fully enclosed protective cabinet
  • Stability: Marble base for vibration-free operation
  • Flexibility: Rotatable processing platform
Detailed Component 1
Detailed Component 2
Detailed Component 3

Frequently Asked Questions

1. What materials are best suited for the GLC-01 Green Laser? It is specifically designed for brittle materials (like glass and ceramics), high-hardness metals, and heat-sensitive substrates where minimal thermal damage is required.
2. What is the standard cutting precision? The system achieves a high cutting precision of ±0.05mm, making it ideal for micro-electronics and precision medical components.
3. Can the processing area be customized? Yes. While the standard processing area is 150×150mm, we offer customization options to meet specific industrial requirements.
4. What type of motion system does the machine use? It utilizes high-precision Linear Motors for the X/Y-axis (200mm travel) and a Ball Screw system for the Z-axis (100mm travel).
5. Does the machine require a special environment? For optimal precision and longevity of the laser source and optics, a clean room environment is highly recommended.
6. How is the laser cooled? The system includes a dual-temperature controlled water chiller to ensure stable laser power output during continuous operation.

Related Products