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| Machine Model | EP-15/25/30-THG-S |
| Laser Wavelength | 355nm |
| Laser Power | 4W / 7W / 10W / 15W / 25W |
| Min. Marking Line Width | 10µm-15µm |
| Marking Speed | 250 characters/sec |
| Marking Scope | 100*100mm |
| Standard Lens | F160 |
| Cooling Mode | Water cooling |
| Power Supply | AC 220V, 50Hz, 16A |
| Overall Dimension | 800mm*950mm*1630mm |
Providing integrated semiconductor industry equipment solutions globally. Our product range includes Die Bonders, Wire Bonding, Laser Marking (ID IC Wafer), Laser Grooving, Laser Cutting (Glass, Ceramics, Wafers), and Automatic Silicone Dispensing Equipment.

