Advanced Quartz Loading System for Optimal Material Diffusion

Customization: Available
After-sales Service: Provide
Warranty: 12 Months

Product Description

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Basic Information

Product Name
Quartz Boat Loading and Unloading Machine
Feature
Intelligent Photovoltaic Transmission Automation
Certification
ISO
Condition
New
Transport Package
Customized or Wooden Box Packaging
Origin
China
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Product Description

G Texturing And Etching Automatic Loading And Unloading Machine

G Texturing And Etching Automatic Loading And Unloading Machine

Use Of Equipment: Automatic loading of stacked silicon wafers for texturing process.

  • Capacity(2 channels): ≥ 9600 - 14000 pcs/h
  • Fragment Rate: ≤ 0.02%
  • Power On Rate: ≥ 99%
Chain Oxidation Automation Equipment

Chain Oxidation Automation Equipment

Use Of Equipment: Automatic feeding for chain oxidation process.

  • Capacity: ≥ 9500 pcs/h
  • Fragment Rate: ≤ 0.01%
  • Power On Rate: ≥ 99%
PVD automatic wafer loading and unloading machine

PVD Automatic Wafer Loading and Unloading Machine

Use Of Equipment: Automatic chip loading and unloading for PVD process of hit battery.

  • Capacity: ≥ 4000 pcs/h
  • Fragment Rate: ≤ 0.05%
  • Power On Rate: ≥ 99%
SSX PECVD Automatic Loading and Unloading Wafer Machine

SSX PECVD Automatic Loading and Unloading Wafer Machine

Use Of Equipment: Automatic loading and unloading sheet for tubular PECVD graphite boat.

  • Capacity: ≥ 5400 pcs/h
  • Fragment Rate: ≤ 0.04%
  • Power On Rate: ≥ 99%
Quartz boat loading and unloading machine

Quartz Boat Loading and Unloading Machine

Use Of Equipment: Automatic loading and unloading of quartz boat for diffusion and annealing process.

  • Capacity: ≥ 9600 pcs/h
  • Fragment Rate: 0.03%
  • Power On Rate: ≥ 99%
Efficient PERC battery ALD loading and unloading equipment

Efficient PERC Battery ALD Loading and Unloading Equipment

Use Of Equipment: Automatic chip loading and unloading for ALD process.

  • Capacity: ≥ 7500 pcs/h
  • Fragment Rate: ≤ 0.02%
  • Power On Rate: ≥ 99%
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Application

Equipment Application
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Exhibition & Customers

Exhibition 1 Exhibition 2
Equipment is currently imported and exported to over 30 countries, with over 200 customers and suppliers, aiming to control the procurement of the highest cost-effective products. Main product range includes: Die Bonder, Wire Bonding, Laser Marking (ID IC Wafer), Laser Grooving, Laser Cutting (Glass Ceramics Wafers Packaging), Laser Internal Modification Machine, Laser Annealing Machine, Automatic Dicing Saw Machine, and Automatic Silicone Dispensing Equipment.
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Packaging & Shipping

Packaging and Shipping Details
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FAQ

How to choose a suitable machine?
You can tell us the working piece material, size, and the requested machine function. We will recommend the most suitable configuration based on our extensive industry experience.
What is the warranty period for the equipment?
We provide a one-year warranty and 24-hour online professional technical support to ensure your production remains uninterrupted.
What is the typical fragment rate for your loading machines?
Our advanced automation systems maintain extremely low fragment rates, typically ranging from ≤ 0.01% to ≤ 0.05% depending on the specific process and machine type.
Can these machines handle high-capacity industrial production?
Yes, our equipment is designed for high throughput. For example, our texturing loading machines can achieve capacities of ≥ 14,000 pcs/h with a power-on rate of ≥ 99%.
Do you support international shipping and packaging standards?
All equipment is packed in customized or high-quality wooden boxes to ensure safety during international transit to over 30 countries.
What processes are your automation machines compatible with?
Our machines cover a wide range of semiconductor and photovoltaic processes, including Diffusion, PECVD, PVD, ALD, Texturing, and Etching.

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