Advanced Laser Marking System for High-Volume PCBA Manufacturing

Customization:	Available
After-sales Service:	Provided
Warranty:	Provided

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Basic Information

Model NO.

HMLY-01

Laser Visibility

Visible

Applicable Material

Metal

Cooling System

Air Cooling

Technical Class

Continuous Wave Laser

Laser Wavelength

UV Laser, CO2 Laser

Laser Classification

Semiconductor Laser

Type

Semiconductor Laser Marking Machine

Marking Method

Scanning Marking

Product Name

PCBA & IC & Wafer Marking Machine

Feature 1

Guaranteed Quality

Feature 2

Customized According to Needs

Origin

China

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Product Description

🔹 Application Areas:

Used in household appliances, office equipment, automotive circuits and other fields.
Meet the laser marking requirements of PCBA (FPC) circuit board manufacturers.

🔹 Key Features:

Automatic loading and unloading, positioning, coding, reading and proofreading, automatic receiving, flipping and double-sided marking for large-size PCBA boards.
Optional servo platform: transmits power through high-precision ball screws and linear guides for precise linear movement.
Optional linear platform: integrated motion control system with linear motors and encoders for fast response.
Automatic focusing system: ensures coding quality for products with different thicknesses.
Adsorption fixture: Negative pressure adsorption ensures stability during coding.
Optional plate turning machine: Realizes double-sided processing, compatible with industrial robots.

Machine Type	HDZ-PCB6565AL
Adapt to PCB Board Size	Min: 100 × 100mm
Adapt to PCB Board Size	MAX: 650 × 750mm
Adapt to PCB Board Thickness	0.5mm - 3mm
Adapt to Package Substrate Size	MAX: 650 * 750mm
Package Substrate Thickness	0.2mm - 4.2mm
Laser Light Source	CO2, Green light, Ultraviolet, Optical fiber
Machining Accuracy	±0.1mm (CCD positioning)
Power Supply	380V, 50Hz
Equipment Size	3090mm * 2000mm * 1950mm

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Exhibition & Customers

We are mainly engaged in international trade and integration of semiconductor industry equipment. Our equipment is currently exported to over 30 countries, serving over 200 customers and suppliers globally. We focus on providing high cost-effective products and risk avoidance for our partners.

Main Product Lines: Die Bonder, Wire Bonding, Laser Marking (ID IC Wafer), Laser Grooving, Laser Cutting (Glass Ceramics Wafers Packaging), Laser Internal Modification Machines, Laser Annealing, and Automatic Dicing Saw Machines.

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Packaging & Shipping

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Frequently Asked Questions

How do I choose the most suitable marking machine?

You can provide us with the workpiece material, size, and specific functional requirements. Our experts will recommend the optimal machine based on extensive industry experience.

What materials can this equipment process?

This system is specifically designed for PCBA (FPC) boards, IC, Wafer marking, and various metal materials used in semiconductor manufacturing.

What is the warranty and technical support policy?

We provide a one-year warranty on all equipment, complemented by 24-hour online professional technical support to ensure seamless production.

Can the machine perform double-sided marking?

Yes, the equipment can be equipped with a customized plate turning machine to realize automatic flipping and double-sided processing of PCBA boards.

What laser sources are available for integration?

The system is highly flexible and can be equipped with CO2, Green light, Ultraviolet (UV), or Optical Fiber laser sources depending on your marking requirements.

How does the machine ensure high marking accuracy?

Accuracy is maintained through high-precision ball screws, linear guides, and a CCD positioning system that achieves a machining accuracy of ±0.1mm.