1 / 5
Engaged in international trade and integration of semiconductor industry equipment. The equipment is exported to over 30 countries, with over 200 customers and suppliers, aiming to provide high cost-effective products.
Main products: Die Bonder, Wire Bonding, Laser Marking (ID IC Wafer), Laser Grooving, Laser Cutting (Glass Ceramics Wafers Packaging, Laser Internal Modification Machine Si /Sic Wafe, Laser Internal Modification Machine Lt/Ln Wafer, Laser Annealing Machine for Si/Sic, Automatic Dicing Saw Machine (Wafer Packaging)), Automatic Silicone Dispensing Equipment.