👥 Exhibition & Customers
Established in 2019, mainly engaged in international trade and integration of semiconductor industry equipment. The equipment is currently imported and exported to over 30 countries, with over 200 customers and suppliers, aiming to control the procurement of the highest cost-effective products in the final stage for customers, and strive for risk avoidance for suppliers.
Our main products include: Die Bonder, Wire Bonding, Laser Marking (ID IC Wafer), Laser Grooving, Laser Cutting (Glass Ceramics Wafers Packaging), Laser Internal Modification Machine Si/Sic Wafer, Laser Internal Modification Machine Lt/Ln Wafer, Laser Annealing Machine for Si/Sic, Automatic Dicing Saw Machine (Wafer Packaging), and Automatic Silicone Dispensing Equipment.
? Frequently Asked Questions
Q1: How to choose a suitable machine?
A1: You can tell us the working piece material, size, and the requested machine function. We can recommend the most suitable machine based on our extensive experience.
Q2: What is the warranty period for the equipment?
A2: We provide a one-year warranty and 24 hours online professional technical support to ensure your production remains stable.
Q3: Do you provide OEM/ODM services?
A3: Yes, we provide full OEM and ODM services. We can customize machine specifications and optical systems based on your specific wafer processing needs.
Q4: What sizes of wafers can this laser annealing system handle?
A4: The system standardly supports 6-inch and 8-inch wafers, which are common in current semiconductor manufacturing processes.
Q5: What are the main features of the laser system?
A5: It features high reliability, an independently developed optical system with LIET technology, and offers options for both Green and UV laser wavelengths.
Q6: How is the equipment protected during shipping?
A6: We use customized or professional wooden box packaging to ensure the precision laser components and mechanical structures are fully protected during international transport.
Stylo Laser
