High-Precision UV Laser Marking System for Food Packaging Solutions

Customization:	Available
After-sales Service:	Provided
Warranty:	Provided

ⓘ Basic Information

Model NO.

EP-15-THG-S

Laser Visibility

Visible

Applicable Material

Metal

Cooling System

Air Cooling

Technical Class

Continuous Wave Laser

Laser Wavelength

Fiber Laser

Laser Classification

Semiconductor Laser

Type

YAG Laser Marking Machine

Marking Method

Scanning Marking

Product Name

UV Laser Marking

Features

Guaranteed Quality, Customized Needs

Origin

China

⚙ Product Description

Brief Description

✓ Marking of electronic products' LOGO, model, and origin.
✓ Marking of food, PVC pipe, medicine packaging (HDPE, PO, PP).
✓ Micro-hole drilling (diameter d≤10μm).
✓ PCB marking and cutting.

Key Features

● Cold laser processing with a small heat-affected zone for high-quality results.
● Wide applicable materials range, expanding beyond infrared laser capabilities.
● Excellent beam quality and small focusing spot for superfine marking.
● High marking speed, efficiency, and precision.
● No consumables, ensuring low operational and maintenance costs.
● Stable overall machine performance for long-term industrial operation.

▤ Technical Specifications

Machine model	EP-15/25/30-THG-S
Laser wavelength	355nm
Laser power	4W / 7W / 10W / 15W / 25W
Min. marking line width	10µm-15µm
Marking speed	250 characters/sec
Marking scope	100*100mm
Standard lens	F160
Pulse repetition frequency	10-200kHz
Cooling mode	Water cooling
Power supply	AC 220V, 50Hz, 16A
Total power consumption	≤1.5kW
Overall dimension	800mm950mm1630mm

🌐 Global Reach & Products

Our equipment is currently integrated into industrial workflows across over 30 countries, serving a network of over 200 customers and suppliers. We aim to provide the most cost-effective semiconductor and laser equipment solutions while ensuring risk avoidance and quality assurance.

Main Product Range: Die Bonder, Wire Bonding, Laser Marking (ID IC Wafer), Laser Grooving, Laser Cutting (Glass Ceramics Wafers Packaging), Laser Internal Modification Machines, Laser Annealing, Automatic Dicing Saws, and Silicone Dispensing Equipment.

📦 Packaging & Shipping

? Frequently Asked Questions

Q1: How to choose a suitable UV laser marking machine?

A1: You can provide us with your workpiece material, size, and the required marking functions. We will recommend the most suitable laser power and configuration based on our extensive industry experience.

Q2: What is the warranty period for this equipment?

A2: We provide a one-year warranty along with 24-hour online professional technical support to ensure your production remains uninterrupted.

Q3: What materials are best suited for UV laser marking?

A3: UV lasers are ideal for materials sensitive to heat, including various plastics (PP, PO, HDPE), PVC pipes, glass, ceramics, and PCB wafers, as well as high-precision metal marking.

Q4: Does the UV laser machine require any consumables?

A4: No, one of the primary advantages of this system is that it requires no consumables, which significantly reduces long-term operating costs compared to traditional marking methods.

Q5: What is the benefit of "Cold Laser" processing?

A5: Cold laser processing uses a short wavelength (355nm) to break molecular bonds without generating excessive heat, preventing thermal deformation or burning of the material surface.

Q6: How is the equipment cooled during operation?

A6: Depending on the specific model and power, the system utilizes either high-efficiency air cooling or precision water cooling to maintain stable performance during continuous operation.