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| Machine model | EP-15/25/30-THG-S |
| Laser wavelength | 355nm |
| Laser power | 4W / 7W / 10W /15W / 25W |
| Min. marking line width | 10µm-15µm |
| Marking speed | 250 characters/sec |
| Marking scope | 100*100mm |
| Standard lens | F160 |
| Pulse repetition frequency | 10-200kHz |
| Cooling mode | Water cooling |
| Power supply | AC 220V, 50Hz, 16A |
| Total power consumption | ≤1.5kW |
| Overall dimension | 800mm*950mm*1630mm |
Our solutions focus on the integration of advanced semiconductor industry equipment. We serve hundreds of customers and suppliers globally, aiming to provide high cost-effective products and risk-free procurement solutions. Main equipment categories include Die Bonders, Wire Bonding, Laser Marking (ID IC Wafer), Laser Grooving, Laser Cutting for Glass/Ceramics/Wafers, and Automatic Dicing Saw Machines.
Standard wooden box packaging or customized solutions are provided to ensure the equipment's safety during international transport.