1 / 5
| Laser IC Marking Equipment | Key Features |
|---|---|
| MES Integration | Supports MES Mark module system |
| Automation | Mark auto-download capabilities |
| Data Handling | Automatic generation of printing information |
| 2D Marking | Supports Mark 2D functionality |
| Defect Detection | Automatically reads Mapping to distinguish printing defects |
| LOT Management | Supports LOT END printing clearance function |
| Text Replacement | Supports scanning to replace text |
| Text Alignment | Automatic text alignment with fixed text width |
We are mainly engaged in international trade and integration of semiconductor industry equipment. The equipment is currently imported and exported to over 30 countries, with over 200 customers and suppliers, aiming to control the procurement of the highest cost-effective products for customers.
Main Product Line: Die Bonder, Wire Bonding, Laser Marking (ID IC Wafer), Laser Grooving, Laser Cutting (Glass Ceramics Wafers Packaging, Laser Internal Modification Machine Si/Sic Wafe, Lt/Ln Wafer, Laser Annealing Machine), Automatic Dicing Saw Machine, and Automatic Silicone Dispensing Equipment.
Our products are packaged using professional wooden box standards or customized requirements to ensure maximum safety during international transit.