Advanced IC Laser Marking System for Efficient Automated Printing

Customization: Available
After-sales Service: Provided
Warranty: Provided

Product Description

📊 Basic Info
Model NO.
LC_02
Laser Visibility
Visible
Applicable Material
Metal
Cooling System
Air Cooling
Technical Class
Continuous Wave Laser
Laser Wavelength
Green Laser
Laser Classification
Semiconductor Laser
Type
Semiconductor Laser Marking Machine
Marking Method
Scanning Marking
Product Name
Laser IC Marking Equipment
Feature 1
Guaranteed Quality
Feature 2
Customized According to Needs
Origin
China
⚙️ Product Description
Laser IC Marking Equipment

Laser IC Marking Equipment Features:

  • Support MES Mark module system
  • Mark Auto download functionality
  • Automatic generation of printing information
  • Supports Mark 2D functionality
  • Automatically read Mapping to distinguish printing defects
  • Support LOT END printing clearance function
  • Support scanning to replace text
  • Automatic text alignment with fixed text width
Equipment Specifications
Laser IC Marking Equipment Key Features
MES IntegrationSupports MES Mark module system
AutomationMark auto-download capabilities
Data HandlingAutomatic generation of printing information
2D MarkingSupports Mark 2D functionality
Defect DetectionAutomatically reads Mapping to distinguish printing defects
LOT ManagementSupports LOT END printing clearance function
Text ReplacementSupports scanning to replace text
Text AlignmentAutomatic text alignment with fixed text width
🤝 Exhibition & Customers

We are mainly engaged in international trade and integration of semiconductor industry equipment. The equipment is currently imported and exported to over 30 countries, with over 200 customers and suppliers, aiming to control the procurement of the highest cost-effective products for customers.

Exhibition View
Customer Visit

Main Product Line: Die Bonder, Wire Bonding, Laser Marking (ID IC Wafer), Laser Grooving, Laser Cutting (Glass Ceramics Wafers Packaging, Laser Internal Modification Machine Si/Sic Wafe, Lt/Ln Wafer, Laser Annealing Machine), Automatic Dicing Saw Machine, and Automatic Silicone Dispensing Equipment.

📦 Packaging & Shipping

Our products are packaged using professional wooden box standards or customized requirements to ensure maximum safety during international transit.

Packaging Details
Frequently Asked Questions
How to choose a suitable machine?
You can tell us the working piece material, size, and the requested machine function. We can recommend the most suitable machine based on our extensive industry experience.
What is the warranty period for the equipment?
We provide a one-year warranty along with 24-hour online professional technical support to ensure your production remains uninterrupted.
Does the equipment support MES integration?
Yes, the Laser IC Marking Equipment supports the MES Mark module system for seamless integration into your automated production line.
Can the machine be customized to my specific needs?
Absolutely. As noted in our features, we offer customization according to the specific needs of our clients' production environments and materials.
What kind of after-sales service do you provide?
We provide comprehensive after-sales service, including remote technical guidance and professional support to help you maintain optimal equipment performance.
What are the typical packaging methods for international shipping?
We use high-standard wooden boxes or customized packaging designed for international transport to prevent any damage during shipping.

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