Advanced Industrial Magnetron Sputtering System for Precision Coatings

Customization: Available
Feature 1: High Precision
Feature 2: High Efficiency

Product Description

Basic Information
Model NO.
PVDM-01
After-Sale Service
Provided
PVD
Aicu, AISI, Al/Si/Cu
Control System
PLC
Control Precision
10ms
Sputtering Rate
1.5 Micron/Min
Degas Chamber
500c
Deposition Rate
Wafer Temp 80c@10kw
Capacity
100 Units
Product Overview
Our independently developed physical vapor deposition (PVD) magnetron sputtering system is compatible with both front-side and back-side metalization processes (for thin-wafer bonding applications). It is equipped with a standard 8-sided unipolar and bipolar automatic platform. The sputtering chamber adopts a single-wafer design, which can be configured as a standard magnetron sputtering chamber, high-vacuum chamber, or KF sputtering chamber. The system features mature vacuum solutions and RF systems, along with a self-developed human-machine interface (HMI) based on the Windows platform, ensuring simple and user-friendly operation.
Applications: The system is compatible with 4-inch to 8-inch production lines for Si, SiC, GaN, GaAs, and other materials. It is suitable for metal coating requirements in integrated circuits, power devices, MEMS, and other applications.
Key Features
  • Achieve precise regulation of perovskite band gaps and dynamic control of nucleation and growth
  • Realize the co-evaporation of wide/narrow bandgap perovskite inorganic layers to facilitate the development of efficient tandem cells
  • Integrated glove box, vacuum annealing furnace and other functional modules to meet custom requirements
  • High-throughput carrier and mask design to enhance experimental throughput and cycle time
Technical Performance
Item Value
Substrate300mm*300mm*3.2mm, downward compatible
Number of co-evaporation sources2-6
Substrate temperature controlIntegrated Precision Control
Crucible volume40cc
MaintenanceOnce per week
Uniformity (Between/Within)< 5%
System Parameters
Item Value
Dimensions7250mm * 5550mm * 2400mm
System Dimensions
Exhibition & Expertise
Our core product range includes: Die Bonder, Wire Bonding, Laser Marking (ID IC Wafer), Laser Grooving, Laser Cutting (Glass Ceramics Wafers Packaging, Laser Internal Modification Machine Si/SiC Wafer, Laser Internal Modification Machine Lt/Ln Wafer, Laser Annealing Machine for Si/SiC, Automatic Dicing Saw Machine (Wafer Packaging), and Automatic Silicone Dispensing Equipment.
Packaging & Shipping
Packaging Detail
Frequently Asked Questions
How to choose a suitable machine?
You can specify the material of your working piece, the required size, and the desired machine functions. We will recommend the most suitable configuration based on our extensive industry experience.
What is the warranty period for the equipment?
We provide a one-year comprehensive warranty along with 24-hour online professional technical support to ensure your operations run smoothly.
What materials is the PVD system compatible with?
The system is highly versatile and compatible with 4-inch to 8-inch production lines for materials including Si, SiC, GaN, and GaAs.
What type of control system does the equipment use?
The system utilizes a high-precision PLC control system with 10ms precision and a self-developed human-machine interface (HMI) based on the Windows platform.
What are the main industrial applications for this system?
It is ideal for metal coating requirements in integrated circuits, power devices, MEMS, and advanced semiconductor packaging.
Why should we choose your PVD solutions?
We offer specialized OEM/ODM and design services, focusing on high-efficiency deposition rates and superior uniformity (<5%) tailored to your production needs.

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