Stylo Laser
1 / 5
Use Of Equipment: Automatic loading of stacked silicon wafers for texturing process.
| Capacity (2 channels) | ≥ 9600 pcs/h / ≥ 14000 pcs/h |
| Fragment Rate | ≤ 0.02% |
| Power On Rate | ≥ 99% |
Use Of Equipment: Automatic feeding for chain oxidation process.
| Capacity | ≥ 9500 pcs/h |
| Fragment Rate | ≤ 0.01% |
| Power On Rate | ≥ 99% |
Use Of Equipment: Automatic chip loading and unloading for PVD process of hit battery.
| Capacity | ≥ 4000 pcs/h |
| Fragment Rate | ≤ 0.05% |
| Power On Rate | ≥ 99% |
Use Of Equipment: Automatic loading and unloading sheet for tubular PECVD graphite boat.
| Capacity | ≥ 5400 pcs/h |
| Fragment Rate | ≤ 0.04% |
| Power On Rate | ≥ 99% |
Use Of Equipment: Automatic loading and unloading of quartz boat for diffusion and annealing process.
| Capacity | ≥ 9600 pcs/h |
| Fragment Rate | 0.03% |
| Power On Rate | ≥ 99% |
Use Of Equipment: Automatic chip loading and unloading for ALD process.
| Capacity | ≥ 7500 pcs/h |
| Fragment Rate | ≤ 0.02% |
| Power On Rate | ≥ 99% |
