Precision UV Laser Marking System for Automotive PCBA Quality Inspection

Customization:	Available
After-sales Service:	Provided
Warranty:	Provided

📊 Basic Information

Laser Visibility

Visible

Applicable Material

Metal

Cooling System

Air Cooling

Technical Class

Continuous Wave Laser

Laser Wavelength

UV Laser, CO2 Laser

Laser Classification

Semiconductor Laser

Type

YAG Laser Marking Machine

Marking Method

Scanning Marking

Product Name

PCBA & IC & Wafer Marking Machine

Origin

China

🔍 Product Description

Brief Overview

This precision system is applicable for digital products, wearable devices, automotive PCBA, mobile phone PCBA, FPC, and more. It is specifically designed for marking on rigid and flexible printed circuit boards (PCBAs), supporting 1D barcodes, 2D Matrix, QR codes, logos, and batch number marking.

Key Features

Fully-automatic loading and unloading from hanging basket to hanging basket with stable laser output.
Intelligent vision system for direction inspection and sampling inspection of marking effects.
User-friendly Human-Machine Interface (HMI).
Equipped with 20W fiber laser marking system; options for green, UV, and CO2 laser sources available.
Special fume removal device to protect the marking environment by extracting dust and smoke.
Compliance with CE MARK and SEMI standards.

⚙️ Technical Specifications

Parameter	HDZ-SIC100	HDZ-SIC200
Marking scope	320mm*160mm	320mm*160mm
Product specification	L: 160-320mm; W: 30-80mm	L: 160-320mm; W: 30-80mm
Font	TFT and SHX; with font library module modification program
Positioning precision	±0.1mm	±0.1mm
UPH (idle)	1200 pieces/h	1200 pieces/h
Power supply	AC 220V, 50/60Hz	AC 220V, 50/60Hz
Air source	0.6-0.8 MPa	0.6-0.8 MPa
Overall dimension	252516652000mm	251514202000mm

🌍 Exhibition & Industry Applications

Our solutions are widely utilized in international trade and integrated semiconductor industry equipment. Our equipment is trusted in over 30 countries by hundreds of customers and suppliers.

Main Product Categories: Die Bonder, Wire Bonding, Laser Marking (ID IC Wafer), Laser Grooving, Laser Cutting, Laser Internal Modification Machines, and Automatic Dicing Saw Machines.

📦 Packaging & Shipping

❓ Frequently Asked Questions

How to choose a suitable machine?

You can share your workpiece material, dimensions, and desired functions. We will recommend the most suitable configuration based on our extensive industry experience.

What is the warranty period for the equipment?

We provide a one-year warranty along with 24-hour online professional technical support to ensure your operations run smoothly.

Can the laser source be customized?

Yes, the system supports various laser sources including Fiber, UV, Green, and CO2 lasers to meet specific material marking requirements.

How do you ensure product quality before shipping?

Each machine undergoes rigorous testing and sampling inspection of the marking effect. Our intelligent vision system also checks for directional accuracy during the process.

What is the typical lead time for an order?

Lead times typically vary between 15 to 30 days depending on the machine model and customization requirements.

Do you provide installation and training?

Yes, we offer comprehensive technical guidance and support to help your team operate the HMI and maintain the equipment effectively.