• Automatic constant temperature system to ensure fluid consistency.
• Laser Height Detection to calibrate Z-axis automatically for component deformation.
The TSV Series desktop dispensing system is applicable for LENS dispensing, FPC package, SMT red glue dispensing, solder paste dispensing, LED package, fingerprint identification module, etc.
| Specifications | TSV-300 | HSV-300 |
|---|---|---|
| Dimension (mm) | L810×W660×H760 | L900×W650×H1460 |
| Weight (kg) | 105 | 190 |
| Control | Industrial personal computer + motion control card | |
| Software | Anda control software + windows system | |
| Programming | Visual programming | |
| Spindle drive | Servo motor + module | |
| Working area (mm) | X:260 ; Y:260 ; Z:100 | |
| Max. Moving speed | 800 mm/s | |
| Repeatability | ± 0.025 mm | |
| Safety standards | CE | |
Our equipment is currently imported and exported to over 30 countries, with over 200 customers and suppliers, aiming to control the procurement of the highest cost-effective products. We specialize in semiconductor industry equipment integration.


Main Product Line: Die Bonder, Wire Bonding, Laser Marking (ID IC Wafer), Laser Grooving, Laser Cutting, Automatic Dicing Saw Machine, and Automatic Silicone Dispensing Equipment.