Core Features
- Automatic glue remover (Flush runner residual glue machine).
- Equipped with Advanced PLC Control (Omron).
- One-time punching/removal of gate runners after plastic sealing.
- Safety Systems: Double switch, emergency stop, light curtain, and safety door protection.
Equipment Advantages
Using imported raw materials and advanced manufacturing equipment, this system ensures high precision and stable performance. We offer customization on demand to meet specific production needs, ensuring strong wear resistance and long service life.
Exhibition & Product Scope
Main product range includes: Die Bonder, Wire Bonding, Laser Marking (ID IC Wafer), Laser Grooving, Laser Cutting (Glass Ceramics Wafers Packaging), Laser Internal Modification Machines (Si/Sic, Lt/Ln Wafers), Laser Annealing Machines, and Automatic Dicing Saw Machines.
Frequently Asked Questions
How to choose a suitable machine?
You can share your working piece material, size, and required functions. Based on our experience, we will recommend the most suitable configuration for your needs.
What is the warranty period for the equipment?
We provide a one-year warranty along with 24-hour online professional technical support to ensure your operations run smoothly.
Can the equipment be customized?
Yes, we provide OEM/ODM services and can customize the equipment based on your specific industrial requirements and package types.
What safety features are included in the machine?
The equipment is built with a comprehensive safety protection system, including double switch protection, emergency stop buttons, light curtain protection, and safety door interlocks.
Which control system does the machine use?
The machine utilizes a high-reliability Omron PLC control system to ensure precision and long-term stability in semiconductor processing.
What kind of packaging is used for shipping?
We typically use customized wooden box packaging to ensure the equipment is fully protected during international transit.